KETEP 세계에너지시장정보

Acknowledgements ................................................................................................... 6 

List of abbreviations .................................................................................................. 7 

Executive summary ................................................................................................... 8 

1 Introduction ...................................................................................................... 10 

2 Degradation and Failure modes in recent technologies entered the market ..... 11 
 2.1 Cut Si wafer-based cell cracking and multi-wire design .......................... 11 
 2.2 Light-induced degradation ....................................................................... 12 
 2.3 Potential-induced degradation ................................................................ 14 
 2.4 Protection of substrings in the modules................................................... 24 
 2.5 Encapsulation degradation and failure modes ........................................ 29 
 2.6 New material degradation modes specific to TOPCon and SHJ ............. 38 

3 Perovskite-based future technologies .............................................................. 44 
 3.1 Intrinsic degradation causes ................................................................... 44 
 3.2 Cell-device-specific degradation modes .................................................. 45 
 3.3 Extrinsic degradation causes .................................................................. 46 
 3.4 Module-device-specific degradation modes ............................................ 46 
 
4 Conclusion ....................................................................................................... 48 

References ............................................................................................................. 50